Diamond Abrasive Backing Pad Ø125mm
RCD diamond abrasive backing pad, diameter 125 mm, with high-density molecular sintering technology.
Ideal for removing adhesives, glues, epoxy products, paints.
7C Tools’ RCD diamond abrasive backing pad, with a diameter of 125 mm, is designed to effectively remove difficult-to-treat elements such as tile adhesives, adhesives, epoxy products and paints.
Using the Reinforced Cluster Diamond (RCD) process, this backing pad uses advanced high-density molecular sintering technology, which combines a large concentration of diamond with a minimized metal bonding matrix.
This gives the backing pad excellent diamond retention capacity, ensuring durable and uniform performance.
The perfectly flat diamond-dotted surface facilitates uniform and fast removal, while the conformation of the backing pad is designed to improve the flow of debris to the suction holes.
Ideal for construction professionals and do-it-yourself enthusiasts, the RCD diamond abrasive backing pad from 7C Tools offers efficiency and precision in every removal job.
| Pieces per Pack | 1pc |
|---|---|
| Packaging per Box | 6pcs |